How to reduce the cost of LED display modules from the design?
As we all know, the basic unit that composes the display box unit is the module. The use environment is divided into two types: indoor and outdoor. According to conventional products, the composition of indoor products is: bottom shell, mask, light board and Accessories, etc. The composition of outdoor products is: sealing ring, bottom shell, mask, light board, sealant and accessories, etc.
Regarding the composition structure of module products, leaving aside the original design thinking mode, in accordance with the design ideas of "integrated" modules, the non-independent (relevant) design of each component will greatly reduce the module products. The cost can be described separately from the following major aspects:
The integrated design of the light board: As an important part of the module, the cost of the light board will directly affect the sales price of the terminal product, in other words, it is closely related to the profit brought by the product. Usually, the light board is mainly composed of LED, circuit board, driving circuit, etc. which are composed of the following parts.
For display manufacturers, designers design these separate and independent component products on a module product and combine them by electronic processing to form a module product. If in the design of a module product, These independent components can be partially integrated or fully integrated, which will greatly reduce the cost of module products.
First is the integration of LED chips and packaging: the LED chips are directly bound on the middle layer of the circuit board, and then sealant is directly poured into the bound recesses to form an integral LED display part of the integrated module.
Module products using this design method are much simpler than the traditional process of producing dot matrix modules. The related links from die bonding, wire bonding, sealant dispensing and other related links can be completed by automated equipment, which greatly improves the production capacity and seals. The amount of materials used is precisely controllable, and the amount of materials used is also greatly reduced.
From the cost point of view, compared with the module products manufactured by the conventional process, two parts of the cost are mainly reduced. The first is the profit of the LED package product market sales and some of the material costs (support and housing); the second package product The subsequent electronic processing costs.
Of course, in addition to the above direct cost reduction, there are also intangible cost reductions, such as the simplification of processing technology, the increase in production capacity, the increase in product qualification rate, and the reduction of manufacturing costs and after-sales service costs; product line manufacturing The reduction of links has shortened the production cycle of the product; the improvement of many factors such as the improvement of efficiency and the reduction of personnel has brought about a significant reduction in management costs, and the LED manufacturing industry will take a big step towards high-end manufacturing.
Considering comprehensively for module products of different specifications, especially small-pitch high-density products, the cost of this COB binding production method is reduced by 40-70% compared with similar products in the current conventional practice, or higher.
The second is the integration of drive and control design: For high-density and small-pitch module products, if the existing conventional drive mode and control system are used, a lot of electrical components will be used, which makes the design very complicated and will The reliability and stability of the product have a certain impact and increase the difficulty in the production, processing, assembly and other processes. In order not to reduce the pass rate of the product, relatively speaking, the process control requirements for the product are more stringent.
Due to the increase in density, the amount of information processed by the control card per unit area increases. In order not to reduce related technical indicators, such as grayscale, refresh rate, etc., the number of control cards used per unit area will increase, in a small space , It becomes very difficult to make the product have good manufacturability. If an intelligent-driven approach is adopted for design, the above contradictions may be fully resolved, which can be briefly described from the following two main aspects:
The driver part (in conjunction with IC manufacturers or others) has greatly improved the integration of existing driver ICs. According to the current specifications of small-pitch products and the convenience and reliability of the design, determine the number of driver output ports. In terms of pin distribution, it meets the convenience requirements of PCB design to the greatest extent. As for the form of driver IC products, two methods can be used: packaging and binding.
For ordinary users, using the package form will be more flexible in terms of design and use; for users with binding equipment, you can directly bind the IC to the circuit board. This method is easy to drive the IC. The volume is smaller and the cost is lower than that of the packaged form. The disadvantage is that it is not universal, and the after-sales service is difficult.
The control part (in conjunction with the control card manufacturer or others) is built on the basis of a substantial increase in the integration of the driver IC. The physical space saved by this can be transferred to the driver board to complete the circuit design of the receiving control card, so that the driver and The control design is combined to form an intelligent drive. The effect of this scheme can not only improve the manufacturability of the product, but also greatly improve the stability and reliability of the product.
At the same time, the application of module products will be more flexible. For example, the brightness correction data and chromaticity correction data of the module itself will not be affected by replacement or changes in position; the combination of modules, the displayed information content, etc. It can be changed freely, so the application of different ideas will become very simple. Through these changes and improvements, the redevelopment of the market will play a positive role in promoting.
The integrated design of the board: Taking into account the heat dissipation of small-pitch module products or other special environmental requirements for non-fan heat dissipation requirements, the use of aluminum and epoxy plates will better solve the heat dissipation problem of the module products, and also Conducive to passing the EMC test requirements; making the product meet the requirements of safety certification as a whole.
In summary, the integrated design of the chip and the package and the integrated design of the drive circuit are organically combined through the circuit board to form the integrated module product (indoor use) described in this article; if Then the integrated design of the receiving control card can be organically combined in the drive design, then the intelligent drive integrated module product described in this article (for indoor use) is formed.
The integration of indoor and outdoor products: the indoor and outdoor modular products used in the market at this stage have completely different kit designs. The indoor kit does not need to be waterproof, and the outdoor kit needs to be waterproof, and most of the fronts need to be potted and waterproof. Silicone, the end surface of the fixed structure must be installed with a waterproof seal.
And the integrated module type indoor products do not need to use the plastic kit, the installation connection device can be directly welded on the circuit board, and it does not need to be installed through the bottom shell as the conventional module. At the same time, because the light-emitting device is embedded in the circuit board, the anti-collision performance of the product is much better than conventional during use and transportation.
As for outdoor products with integrated modules, you only need to reduce the length and width dimensions of indoor products with integrated modules to a certain range (such as 0.5mm), so that the integrated modules can be installed on the light-emitting surface with optical The characteristic and completely sealed housing, coupled with the supporting bracket and sealing ring, form an integrated module product that can be used outdoors, eliminating the need for conventional modules to be potted with waterproof silicone.
At the same time, the optical shell has broken through the limitation of the light distribution curve of the existing LED package products, and realized that in terms of optics, the product can be re-developed or customized to meet the special environment of the market. As shown in the following figure, Figure 3 is an indoor type, and Figure 4 is an outdoor type. In summary, the realization of integrated LED display module products can not only bring about the advantages of reducing costs, simplifying processes, and increasing productivity, but also It can also realize the fully automated production of LED module products. In a sense, integrated module products are a product of industrial chain integration.
However, while bringing many benefits, it may have an impact on some of the existing packaging products (mainly suitable for small-pitch packaging products); and it will affect some intermediate links in the industry chain [such as pure packaging companies, (only (Limited to the display industry) electronics processing industry, driver IC traders, plastic kit factories, waterproof material factories, etc.] have a greater impact.
At the same time, related industries supporting the display will also have new development opportunities, such as automated production equipment, circuit board factories, IC manufacturing, new heat dissipation materials, packaging materials, etc.
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