LED display packaging technology:HD small-pitch LED display VS ordinary LED display

Do you know the difference between the LED dispaly packaging of high-definition LED small-pitch display and ordinary LED display? At present, LED display has become an indispensable equipment in many industries, and has formed a complete industrial chain including upstream chips, midstream packaging, Downstream applications, etc., it can be said that packaging is very important in the LED display industry chain. At present, it has entered the development stage of micro-pitch, and the layout of small-pitch displays has become the pioneer of many enterprise reforms.

Exploring a variety of packaging solutions with small pitches will become the guarantee of product quality! What is the relationship between these encapsulation solutions? What LED display packaging technologies are available for ordinary LED displays? What are the differences between high-definition LED small-pitch displays?

The packaging technologies supplied by the two mainly include

Surface Mount (SMD)

The surface mount (SMD) package is to solder single or multiple LED chips on a metal bracket with a plastic “cup” frame (the outer pins of the bracket are respectively connected to the P and N levels of the LED chips), and then to the plastic frame The liquid epoxy resin or organic silica gel is potted inside, and then baked at high temperature to form, and then cut and separated into a single surface mount package device.

Integrated packaging technology IMD (abbreviation: “four in one”)

LED display technology: Into the LED lightsLED label light beads
LED display technology: Into the LED lightsLED label light beads

LED display companies have deep technical accumulation in the SMD mounting process, and the “four-in-one” packaging is a further development based on the inheritance of SMD packaging. The SMD package contains one pixel in one package structure, while the “four-in-one” package contains four pixels in one package structure. Although the four-in-one LED display adopts a new integrated packaging technology IMD (four-in-one), its process The surface mount process is still used.

The “4-in-1” Mini LED module IMD package combines the advantages of SMD and COB, and solves the problems of ink color consistency, seam, light leakage, maintenance, etc. It has the characteristics of high contrast, high integration, easy maintenance, and low cost. It’s a better compromise on the road to smaller pitches.

At present, the “four-in-one” Mini LED module uses a full-scale chip due to cost considerations. As packaging manufacturers make more requirements for chips, they will further launch “six-in-one” and even “N-in-one”. “Program.

Packaging technology only for ordinary LED display:

Straight plug

LED display technology: Into the LED lights
LED display technology: Into the LED lights

Generally simple and old-fashioned, LED lights are directly inserted into the LED module. The most common is the sign above the store, which is generally rectangular, and the color can only display single color or two colors. Color pictures cannot be displayed, so most of them are It is used to display advertising slogans or store names.

COB packaging technology

COB packaging is a technology for LED heat dissipation, which is to adhere the bare chip to the interconnect substrate with conductive or non-conductive glue, and then wire bond to achieve its electrical connection. The COB package adopts integrated packaging technology. Since a single LED device is omitted, the SMT process is performed after packaging.

It can effectively solve the problems of SMD package display screen, because the dot pitch is constantly shrinking, the process difficulty is increased, the yield is reduced, and the cost is increased. COB is easier to achieve small pitch.

If the COB package is directly exposed to the air, it is susceptible to contamination or man-made damage, affecting or destroying the function of the chip, so the chip and the bonding wires are encapsulated with glue, which is also called soft encapsulation.

GOB packaging technology

LED Array Packing Density Comparison
LED Array Packing Density Comparison

GOB is an improvement of SMD surface mount technology. It is a packaging technology. It is a technology to solve the problem of LED lamp protection. It uses an advanced new transparent material to package the substrate and its LED display packaging technology units. effective protection.

The material not only has ultra-high transparency, but also has excellent thermal conductivity. The small spacing of GOB can adapt to any harsh environment, and realize the characteristics of real moisture-proof, waterproof, dust-proof, anti-collision, anti-UV and so on.

Compared with traditional SMD, GOB makes up for the lack of reliability and stability of surface-mount small-pitch displays to a certain extent, and can be used in more harsh environments to avoid large-area dead lights and lights out.

For the LED display packaging technology of small-pitch LED displays, intelligent fluid control automation manufacturers have developed a small-pitch display packaging smart device for this process end; like JYLED’s transparent display packaging line, the original equipment & process are upgraded and transformed , It can be glued for products with complex structures, and an online track is added to the design.

The degree of automation is extremely high. The glue stirring, heating and vacuuming can be selected according to the customer’s process glue requirements. It is suitable for different types of transparent The display perfusion process is as follows:

  1. Diversified product packaging can be easily realized through computer programming;
  2. The equipment is equipped with a photoelectric positioning system to improve the accuracy of product positioning and packaging position;
  3. The XYZ motion axes use high-precision motion guides and are driven by servo motors, which can effectively ensure the high-precision operation of the equipment;
  4. The line body is integrated with single and double liquid and online vacuum degassing equipment to integrate the display light source packaging equipment;
  5. Through the integrated line body, the operation quality, labor cost and production capacity of the display light source packaging process are comprehensively improved.

Summary: The above is the editor’s introduction to the small-pitch display packaging technology and the transparent display packaging line. If you want to know more about the product, you can go directly to the product page or consult customer service to understand and purchase, I hope it can help you!

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WHAT IS AN LED DISPLAY?

LED display is an electronic display made up of LED dot matrix. It can display contents such as text, animation, pictures and video in time by